8 Layers Micro-via Stack up
Category: HDI  Publish Time: 2015-11-26 00:00 

8 Layers Micro-via Stack up
Parameters Layers: 8 Thicknes: 1.2±0.12mm Min. Hole Size: Via/0.3mm

Parameters


Layers: 8


Thicknes: 1.2±0.12mm


Min. Hole Size: Via/0.3mm

               Blind Via/0.15mm


Width/Space: 0.1mm/0.1mm


Surface Treatment: Immersion Au

Crafts


Micro-via Stack up

Applications


Mobile Phone, Tablet


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